{"version":"1.0","provider_name":"Coin Engineer","provider_url":"https:\/\/coinengineer.net\/blog","author_name":"Yigit Taha OZTURK","author_url":"https:\/\/coinengineer.net\/blog\/author\/ceyigitt\/","title":"Hong Kong to Subsidize Companies Issuing Tokenized Bonds! - Coin Engineer","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"QfPVEaTf2a\"><a href=\"https:\/\/coinengineer.net\/blog\/hong-kong-to-subsidize-companies-issuing-tokenized-bonds\/\">Hong Kong to Subsidize Companies Issuing Tokenized Bonds!<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/coinengineer.net\/blog\/hong-kong-to-subsidize-companies-issuing-tokenized-bonds\/embed\/#?secret=QfPVEaTf2a\" width=\"600\" height=\"338\" title=\"&#8220;Hong Kong to Subsidize Companies Issuing Tokenized Bonds!&#8221; &#8212; Coin Engineer\" data-secret=\"QfPVEaTf2a\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/\/# sourceURL=https:\/\/coinengineer.net\/blog\/wp-includes\/js\/wp-embed.min.js\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/coinengineer.net\/blog\/wp-content\/uploads\/2024\/11\/hong-kong-1024x576.png","thumbnail_width":1024,"thumbnail_height":576,"description":"The Hong Kong Monetary Authority (HKMA) has launched the Digital Bond Grant Scheme (DBGS), offering subsidies of up to 50% of the costs for companies issuing digital tokenized bonds. This initiative is aimed at boosting the adoption of tokenization in the digital securities market. Companies can receive grants of up to 2.5 million Hong Kong"}