Yigit Taha OZTURK 
The Hong Kong Monetary Authority (HKMA) has launched the Digital Bond Grant Scheme (DBGS), offering subsidies of up to 50% of the costs for companies issuing digital tokenized bonds. This initiative is aimed at boosting the adoption of tokenization in the digital securities market. Companies can receive grants of up to 2.5 million Hong Kong dollars (around $321,184 USD) with two applications allowed per company annually.
To qualify for a grant, the issued bonds must be valued at a minimum of $128.5 million and listed on the Hong Kong Stock Exchange or a licensed platform in Hong Kong. Additionally, applicants must have a substantial physical presence in the region.
HKMA CEO Eddie Yue highlighted that this program is designed to overcome barriers to tokenized bonds adoption and accelerate innovation in Hong Kong’s financial sector. In February 2023, Hong Kong issued $100 million worth of tokenized green bonds, marking a significant step toward the digital asset space. This new grant scheme reinforces Hong Kong’s position as a leading global financial hub.
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